Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
Tin-bismuth eutectic alloy (Sn-58 wt.% Bi) is emerging as a potential lead-free solder alternative. The low melting temperature (138oC) of this alloy makes it a suitable candidate for higher level interconnections and for soldering heat sensitive components. Demands for high density interconnections...
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| フォーマット: | 学位論文 |
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2015
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