Nashrah Hani , J. (2017). Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon.
Chicago Style (17th ed.) CitationNashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
MLA (9th ed.) CitationNashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
Warning: These citations may not always be 100% accurate.