Nashrah Hani , J. (2017). Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon.
Style de citation Chicago (17e éd.)Nashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
Style de citation MLA (9e éd.)Nashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
Attention : ces citations peuvent ne pas être correctes à 100%.