Nashrah Hani , J. (2017). Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon.
芝加哥风格引文Nashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
MLA引文Nashrah Hani , Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer / Nashrah Hani Jamadon. 2017.
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