Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon
The use of lead-based (Pb-based) solder alloy has been reduced mainly in electronics packaging due to Pb toxicity to the environment and human health. Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder alloy is considered compatible combination of lead-free solder to replace conventional Pb-based solder alloy....
| Main Author: | Nashrah Hani , Jamadon |
|---|---|
| Format: | Thesis |
| Published: |
2017
|
| Subjects: |
Similar Items
Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)
by: Tan, Ai Ting
Published: (2017)
Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
by: Asri, Asma Kamarul
Published: (2011)
by: Asri, Asma Kamarul
Published: (2011)
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
by: Binh, Duong Ngoc
Published: (2009)
by: Binh, Duong Ngoc
Published: (2009)
Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir
by: Muhammad , Nasir
Published: (2017)
by: Muhammad , Nasir
Published: (2017)
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)
by: Muhammad Asyraf, Abdullah
Published: (2024)
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012)
by: Bakir, Mohammed Luay
Published: (2012)
Interfacial reactions between lead-free solders and electroless nickel
by: Mohd. Muzamir Mahat
Published: (2009)
by: Mohd. Muzamir Mahat
Published: (2009)
Bismuth-antimony as an alternative material for high temperature lead-free solder
by: Muhamad Zam, Shahrul Fadzli
Published: (2012)
by: Muhamad Zam, Shahrul Fadzli
Published: (2012)
Classical and damage mechanics-based models for lead-free solder interconnects
by: Lai, Zheng Bo
Published: (2009)
by: Lai, Zheng Bo
Published: (2009)
Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
by: Wahab, Abdul Karim Abdul
Published: (2011)
by: Wahab, Abdul Karim Abdul
Published: (2011)
Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012)
by: Rosilli, Rohaizuan
Published: (2012)
Reog Ponorogo: A case study of structure in kumpulan Sri Wahyuni in Batu Pahat / Nina Nashrah Abdul Jalal
by: Nina Nashrah , Abdul Jalal
Published: (2019)
by: Nina Nashrah , Abdul Jalal
Published: (2019)
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
by: Mohd. Yamin, Aliff Farhan
Published: (2012)
by: Mohd. Yamin, Aliff Farhan
Published: (2012)
Study of interfacial reactions between lead-free solders and immersion silver finish
by: Oshaghi, Safoura
Published: (2008)
by: Oshaghi, Safoura
Published: (2008)
Minimization of copper dissolution for lead-free wave soldering in surface mount technology
by: Arunasalam, Mageswaran
Published: (2017)
by: Arunasalam, Mageswaran
Published: (2017)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014)
by: Nahavandi, Mahdi
Published: (2014)
Analysis of selected lead-free solders by optical emission spectroscopy / Yee Chung Lee
by: Yee, Chung Lee
Published: (2014)
by: Yee, Chung Lee
Published: (2014)
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
by: Mad Asasaari, Siti Faizah
Published: (2021)
by: Mad Asasaari, Siti Faizah
Published: (2021)
Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood
by: Md. Arafat, Mahmood
Published: (2012)
by: Md. Arafat, Mahmood
Published: (2012)
Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque
by: Ashraful, Haque
Published: (2011)
by: Ashraful, Haque
Published: (2011)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
by: Ab Ghani, Noor Asikin
Published: (2016)
by: Ab Ghani, Noor Asikin
Published: (2016)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)
by: Abu Hassan, Nurfazlin
Published: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)
by: Idris, Siti Rabiatull Aisha
Published: (2008)
Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010)
by: Boo, Nan Shing
Published: (2010)
Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2013)
by: Mohammad Hossein, Mahdavifard
Published: (2013)
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
by: Zakaria, Mohamad Fadley
Published: (2008)
by: Zakaria, Mohamad Fadley
Published: (2008)
Self-similar network traffic using Successive Random Addition (SRA) algorithm / Hani Hamira Harun
by: Harun, Hani Hamira
Published: (2006)
by: Harun, Hani Hamira
Published: (2006)
Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean
by: Chew, Chee Sean
Published: (2011)
by: Chew, Chee Sean
Published: (2011)
Solder Joint Reliability Of Flip Chip BGA Package
by: Lee, Kor Oon
Published: (2004)
by: Lee, Kor Oon
Published: (2004)
Properties Of Low Temperature Indium-Based Ternary Lead Free Solders System [TS610. S165 2008 f rb].
by: Jahari, Mohamad Salimin
Published: (2008)
by: Jahari, Mohamad Salimin
Published: (2008)
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
by: Osman, Saliza Azlina
Published: (2008)
by: Osman, Saliza Azlina
Published: (2008)
Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
by: Hardinnawirda, Kahar
Published: (2017)
by: Hardinnawirda, Kahar
Published: (2017)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)
by: Nabila, Tamar Jaya
Published: (2024)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)
by: Maliessa Nabilah, Mazelan
Published: (2023)
Application Of Machine Vision On Solder Joint Inspection
Using Orthogonal And Oblique Views
by: Ong , Teng Yeow
Published: (2010)
by: Ong , Teng Yeow
Published: (2010)
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
by: Syed Hassan , Abbas Jaffery
Published: (2017)
by: Syed Hassan , Abbas Jaffery
Published: (2017)
The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging
by: Ahmad, Intan Fatihah
Published: (2022)
by: Ahmad, Intan Fatihah
Published: (2022)
Similar Items
-
Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017) -
Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
by: Asri, Asma Kamarul
Published: (2011) -
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
by: Binh, Duong Ngoc
Published: (2009) -
Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir
by: Muhammad , Nasir
Published: (2017) -
Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)