APA引文

Ashraful, H. (2011). Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque.

芝加哥风格引文

Ashraful, Haque. Development of High-temperature Lead-free Solder for Semiconductor Chip Attachment / Ashraful Haque. 2011.

MLA引文

Ashraful, Haque. Development of High-temperature Lead-free Solder for Semiconductor Chip Attachment / Ashraful Haque. 2011.

警告:这些引文格式不一定是100%准确.