Development of high-temperature lead-free solder for semiconductor chip attachment / Ashraful Haque

Lead (Pb)-free electronic product is a catchphrase of consumer and different regulators worldwide which turns in to an obligatory for the electronic industries to remove Pb from semiconductor assembly for the reason that it is highly toxic, harmful for human health and environment. Alternative as...

書目詳細資料
主要作者:	Ashraful, Haque
格式:	Thesis
出版:	2011
主題:	T Technology (General) TJ Mechanical engineering and machinery

相似書籍

Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
由: Mad Asasaari, Siti Faizah
出版: (2021)

Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
由: Asri, Asma Kamarul
出版: (2011)

Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
由: Tan, Ai Ting
出版: (2017)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
由: Muhammad Asyraf, Abdullah
出版: (2024)

Classical and damage mechanics-based models for lead-free solder interconnects
由: Lai, Zheng Bo
出版: (2009)

Study of interfacial reactions between lead-free solders and immersion silver finish
由: Oshaghi, Safoura
出版: (2008)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
由: Abu Hassan, Nurfazlin
出版: (2009)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
由: Boo, Nan Shing
出版: (2010)

Bismuth-antimony as an alternative material for high temperature lead-free solder
由: Muhamad Zam, Shahrul Fadzli
出版: (2012)

Bismuth-argentum alloys as alternative high temperature lead-free solder
由: Rosilli, Rohaizuan
出版: (2012)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
由: Chellvarajoo, Srivalli
出版: (2016)

Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer / Nashrah Hani Jamadon
由: Nashrah Hani , Jamadon
出版: (2017)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
由: Idris, Siti Rabiatull Aisha
出版: (2008)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
由: Chellvarajoo, Srivalli
出版: (2016)

Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard
由: Mohammad Hossein, Mahdavifard
出版: (2013)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
由: Osman, Saliza Azlina
出版: (2008)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
由: Nahavandi, Mahdi
出版: (2014)

Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean
由: Chew, Chee Sean
出版: (2011)

Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
由: Siah, Meng Zhe
出版: (2019)

Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
由: Zhou , Ding
出版: (2024)

Characterization of Sn-Bi-Co low temperature solder alloy / Lina Syazwana Kamaruzzaman
由: Lina Syazwana , Kamaruzzaman
出版: (2023)

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
由: Shiu , Kai Ping
出版: (2017)

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
由: Bakir, Mohammed Luay
出版: (2012)

High-Temperature Oxidation Of Titanium Aluminides
由: Amrin, Astuty
出版: (2005)

Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
由: Hardinnawirda, Kahar
出版: (2017)

A CFD model development and performance investigation of frost free refrigerator with nanoparticles suspended in the lubricant
由: Haque, Muhammad Ehteshamul
出版: (2019)

A unified constitutive model for solder materials
由: Koh, Yee Kan
出版: (2004)

Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
由: Goh, Ying Xin
出版: (2015)

Pack cementation of high chromium steel for high temperature application in steam condition
由: Farah Alia, Fauzi
出版: (2018)

Interfacial reactions between lead-free solders and electroless nickel
由: Mohd. Muzamir Mahat
出版: (2009)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
由: Tai, Siew Fong
出版: (2003)

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
由: Nabila, Tamar Jaya
出版: (2024)

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
由: Wahab, Abdul Karim Abdul
出版: (2011)

Properties Of Low Temperature Indium-Based Ternary Lead Free Solders System [TS610. S165 2008 f rb].
由: Jahari, Mohamad Salimin
出版: (2008)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
由: Erik Nino, Tolentino
出版: (2020)

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
由: Mohd. Yamin, Aliff Farhan
出版: (2012)

Minimization of copper dissolution for lead-free wave soldering in surface mount technology
由: Arunasalam, Mageswaran
出版: (2017)

Work improvement of semiconductor backend equipment using simulation modeling
由: Perumal, Sritharan
出版: (2011)

Circular edge bow-tie nano antenna for energy harvesting systems / Ahasanul Haque
由: Ahasanul, Haque
出版: (2016)

Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys / Loh Hwei Ling
由: Loh, Hwei Ling
出版: (2019)