Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate / Mohammad Hossein Mahdavifard
In this study, Mo nanoparticles were used as a reinforcing material into the Sn-3.8Ag- 0.7Cu (SAC) solder on the nickel substrate (Cu substrate with an electrodeposited Ni layer on top). The Mo nanoparticles were characterized by transmission electron microscopy (TEM) and X-ray diffractometer (XRD)....
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| منشور في: |
2013
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