Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood
Recent environmental concern led to worldwide legislation banning the use of lead (Pb) containing solders in microelectronic devices. Near eutectic Sn-Ag-Cu solders are considered as replacement for traditional Pb-Sn solders. But Sn-Ag-Cu solder alloys can not guarantee the required performance i...
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| स्वरूप: | थीसिस |
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2012
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