Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
Low-Ag Sn-Ag-Cu (SAC) alloys such as Sn-1 wt.%Ag-0.5 wt.% Cu (SAC105) have been considered as a solution to both the cost and poor drop impact reliability issues of high Ag SAC solders. Moreover, alloying elements have been added into SAC solder alloys to refine the microstructure, and improve the w...
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| 格式: | Thesis |
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2017
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