The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating

Solder acts as a joining material in first level packaging such as controlled collapse chipconnection (C4). It helps to interconnect chip with substrate to provide electrical and mechanical continuity in electronic packaging. The quality of electronic packaging mostly relies on the solder joint that...

書誌詳細
第一著者:	Maliessa Nabilah, Mazelan
フォーマット:	学位論文
言語:	英語
出版事項:	2023
主題:	TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
オンライン･アクセス:	http://umpir.ump.edu.my/id/eprint/39614/1/ir.The%20effect%20of%20different%20Sn-Ag-Cu%20%28SAC%29%20solder%20form%20on%20solder.pdf

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