The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
Solder acts as a joining material in first level packaging such as controlled collapse chipconnection (C4). It helps to interconnect chip with substrate to provide electrical and mechanical continuity in electronic packaging. The quality of electronic packaging mostly relies on the solder joint that...
| मुख्य लेखक: | Maliessa Nabilah, Mazelan |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2023
|
| विषय: | |
| ऑनलाइन पहुंच: | http://umpir.ump.edu.my/id/eprint/39614/1/ir.The%20effect%20of%20different%20Sn-Ag-Cu%20%28SAC%29%20solder%20form%20on%20solder.pdf |
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समान संसाधन
-
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
द्वारा: Nabila, Tamar Jaya
प्रकाशित: (2024) -
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द्वारा: Tai, Siew Fong
प्रकाशित: (2003) -
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द्वारा: Lee, Liu Mei
प्रकाशित: (2013) -
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द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016) -
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