Heat Pipes In Electronic Packaging
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2006
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| Subjects: | |
| Online Access: | http://eprints.usm.my/29322/ |
| Abstract | Abstract here |
| _version_ | 1855631516797763584 |
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| author | Munusamy, Sri Jaiandran |
| author_facet | Munusamy, Sri Jaiandran |
| author_sort | Munusamy, Sri Jaiandran |
| description | Industri electronik berkembang ke arah qualiti dan kelajuan
computational yang tinggi.
The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. |
| first_indexed | 2025-10-17T08:02:30Z |
| format | Thesis |
| id | usm-29322 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2025-10-17T08:02:30Z |
| publishDate | 2006 |
| record_format | EPrints |
| record_pdf | Restricted |
| spelling | usm-293222017-03-22T02:23:55Z http://eprints.usm.my/29322/ Heat Pipes In Electronic Packaging Munusamy, Sri Jaiandran Q Science Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. 2006-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM . |
| spellingShingle | Q Science Munusamy, Sri Jaiandran Heat Pipes In Electronic Packaging |
| thesis_level | Master |
| title | Heat Pipes In Electronic Packaging |
| title_full | Heat Pipes In Electronic Packaging |
| title_fullStr | Heat Pipes In Electronic Packaging |
| title_full_unstemmed | Heat Pipes In Electronic Packaging |
| title_short | Heat Pipes In Electronic Packaging |
| title_sort | heat pipes in electronic packaging |
| topic | Q Science |
| url | http://eprints.usm.my/29322/ |
| work_keys_str_mv | AT munusamysrijaiandran heatpipesinelectronicpackaging |