Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

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Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...

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Bibliographic Details
Main Author:	Tan , Kim Seah
Format:	Thesis
Language:	English
Published:	2015
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/30367/
Abstract	Abstract here

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