Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

अन्य संस्करण दिखाएं (1)

Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखक:	Tan , Kim Seah
स्वरूप:	थीसिस
भाषा:	अंग्रेज़ी
प्रकाशित:	2015
विषय:	TN1-997 Mining engineering. Metallurgy
ऑनलाइन पहुंच:	http://eprints.usm.my/30367/
Abstract	Abstract here

समान संसाधन

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