Effect Of Nanosecond Laser Dicing On Ultrathin Silicon Die With Copper Stabilization Layer

Die ultra-nipis memerlukan satu lapisan kuprum (Cu) penstabilan di belakangnya untuk menghalang ledingan dan retakan semasa proses pengimpalan die serta penyambungan dawai. Pemotongan wafer silikon (Si) dengan lapisan Cu di belakangnya sangat mencabar. Pemotongan dengan bilah secara mekanikal akan m...

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Bibliographic Details
Main Author:	Marks, Michael Raj
Format:	Thesis
Language:	English
Published:	2016
Subjects:	QC1 Physics (General)
Online Access:	http://eprints.usm.my/32200/
Abstract	Abstract here

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