Solder Joint Reliability Of Flip Chip BGA Package
Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2004
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/3572/ |
| Abstract | Abstract here |
| _version_ | 1855631196670656512 |
|---|---|
| author | Lee, Kor Oon |
| author_facet | Lee, Kor Oon |
| author_sort | Lee, Kor Oon |
| description | Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden.
The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages. |
| first_indexed | 2025-10-17T07:52:19Z |
| format | Thesis |
| id | usm-3572 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2025-10-17T07:52:19Z |
| publishDate | 2004 |
| record_format | EPrints |
| record_pdf | Restricted |
| spelling | usm-35722017-04-17T09:26:38Z http://eprints.usm.my/3572/ Solder Joint Reliability Of Flip Chip BGA Package Lee, Kor Oon TA1-2040 Engineering (General). Civil engineering (General) Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages. 2004-03 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf Lee, Kor Oon (2004) Solder Joint Reliability Of Flip Chip BGA Package. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TA1-2040 Engineering (General). Civil engineering (General) Lee, Kor Oon Solder Joint Reliability Of Flip Chip BGA Package |
| thesis_level | Master |
| title | Solder Joint Reliability Of Flip Chip BGA Package |
| title_full | Solder Joint Reliability Of Flip Chip BGA Package |
| title_fullStr | Solder Joint Reliability Of Flip Chip BGA Package |
| title_full_unstemmed | Solder Joint Reliability Of Flip Chip BGA Package |
| title_short | Solder Joint Reliability Of Flip Chip BGA Package |
| title_sort | solder joint reliability of flip chip bga package |
| topic | TA1-2040 Engineering (General). Civil engineering (General) |
| url | http://eprints.usm.my/3572/ |
| work_keys_str_mv | AT leekoroon solderjointreliabilityofflipchipbgapackage |