APA(7版)引用形式

Ong Kean Aik, K. A. (2016). Experimental and Numerical Studies of Transient Heat Transfer in Electronics Packaging.

Chicagoスタイル(17版)引用形式

Ong Kean Aik, Kean Aik. Experimental and Numerical Studies of Transient Heat Transfer in Electronics Packaging. 2016.

MLA(9版)引用形式

Ong Kean Aik, Kean Aik. Experimental and Numerical Studies of Transient Heat Transfer in Electronics Packaging. 2016.

警告: この引用は必ずしも正確ではありません.