Experimental and Numerical Studies of Transient Heat Transfer in Electronics Packaging
Permintaan bagi peranti mudah alih dan tablet adalah tinggi pada setiap masa dalam dekad yang lalu, perhatian yang amat menggalakkan telah ditumpu kepada bidang ini. Sesuatu kajian yang baru diperlukan dalam industri untuk mengiringi permintaan ini adalah untuk menkaji ciri-ciri pemindahan haba se...
| Main Author: | Ong Kean Aik, Kean Aik |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/40781/ |
| Abstract | Abstract here |
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