Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
96.5Sn-3.0Ag-0.5Cu (SAC305) thin film solder exhibits different surface characteristics if compared to conventional bulk solder. In thin film solder, the actual surface is comprised of intermetallic layers whereas in the case of conventional solder, the intermetallic layers happened at the interfac...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2013
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41122/ |
| Abstract | Abstract here |