Tan , K. S. (2015). Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications.
Style de citation Chicago (17e éd.)Tan , Kim Seah. Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications. 2015.
Style de citation MLA (9e éd.)Tan , Kim Seah. Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications. 2015.
Attention : ces citations peuvent ne pas être correctes à 100%.