APA (7th ed.) Citation

Tan , K. S. (2015). Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications.

Chicago Style (17th ed.) Citation

Tan , Kim Seah. Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications. 2015.

MLA (9th ed.) Citation

Tan , Kim Seah. Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications. 2015.

Warning: These citations may not always be 100% accurate.