Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been developed. The Ag-Al nanopaste was studied by varying the Al weight percent in the Ag matrix as well as the organic additives content. The Ag-Al nanopaste was sintered in open air at 380°C for 30 minutes to...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية |
| منشور في: |
2012
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/41148/ |