Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been developed. The Ag-Al nanopaste was studied by varying the Al weight percent in the Ag matrix as well as the organic additives content. The Ag-Al nanopaste was sintered in open air at 380°C for 30 minutes to...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2012
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41148/ |