Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board
Wave soldering is one of the most familiar and well-established processes in the electronics assembly industry, which is used to assemble the pin-through hole (PTH) component onto the printed circuit board (PCB). The solder joint defects such as cracks, void formation, and incomplete filling of the...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2015
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41161/ |