Ramdan, D. (2013). Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction.
Chicagoスタイル(17版)引用形式Ramdan, Dadan. Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction. 2013.
MLA(9版)引用形式Ramdan, Dadan. Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction. 2013.
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