Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction

The reduction of IC chip size has a significant impact to the modern electronic industry especially on the circuit design and IC assembly process. The increasing of I/O counts in a small scale IC chip result in severe wire deformation and deformation issues during transfer moulding process. In this...

Full description

Bibliographic Details
Main Author:	Ramdan, Dadan
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41166/
Abstract	Abstract here

Similar Items

Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
by: Khor, Chu Yee
Published: (2013)

An Hp-Adaptive Finite Element Procedure For Fluid-Structure Interaction In Fully Eulerian Framework
by: Abas, Mohamad Aizat
Published: (2013)

Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board
by: Aziz, Mohd Sharizal Abdul
Published: (2015)

CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
by: Khor , Chu Yee
Published: (2010)

Simulation Of Underfill Encapsulation Of Electrionic Packaging Using The Lattice-Boltzmann Method
by: Gan, Zhong Li
Published: (2018)

Development Of An Auto-Focusing Fluid Lens System
by: Jalal Abdullah, Soran
Published: (2009)

Computational Fluid Dynamics Study Of Nasal Cavity Model
by: Riazuddin, Vizy Nazira
Published: (2011)

Detection Of Chipping In Ceramic Cutting Inserts From Workpiece Profile Signature During Turning Process Using Machine Vision
by: Kiow, Lee Woon
Published: (2017)

Detection Of Chipping In Ceramic Cutting Inserts From Workpiece Profile Signature During Turning Process Using Machine Vision
by: Lee, Woon Kiow
Published: (2017)

Investigation of brake squeal/self induced vibrations.
by: Mohammed, Ammar Abdul Majeed Yousif
Published: (2011)

Numerical Investigation On The Effects Of Geometrical Parameters On Film Cooling Performance
by: Ali, Amir Hussein
Published: (2013)

Numerical And Experimental Investigations Of 2d Membrane Airfoil Performance
by: Abdul Aziz, Mohd Sharizal
Published: (2012)

Numerical And Experimental Investigation Of 2D Membrane Airfoil Performance
by: Aziz, Mohd Sharizal Abdul
Published: (2012)

Model For Decision Making In Implementing Process Imrpovement
by: Low, Shye Nee
Published: (2014)

Molecular Mechanics Simulations Of Quartz Etching Process
by: Abdul Manap, Abdul Haadi
Published: (2016)

Numerical Investigation Of Heat And Mass Transfer In Porous Medium Fixed With Various Geometries
by: Magami, Irfan Anjum Badruddin
Published: (2006)

Optimization Of Injection Moulding Process For Hdpe Moulded Gear
by: Kassim, Mohd Syahir Mohd
Published: (2015)

A Framework For Deployment Of Process Improvement For Manufacturing Industry
by: Loh , Chee Keong
Published: (2011)

Modeling Of Static And Kinetic Friction In Rubber-Pad Forming Process
by: Ramezani, Maziar
Published: (2009)

Experimental And Numerical Investigations On The Performance Of Flexible Skin Flapping Wing For Micro Aerial Vehicle Application
by: Yusoff, Hamid
Published: (2013)

Investigation Of Water Flow Over Contracted Rectangular Flat-Crested Slit Weir In Open Channel
by: Jaafar , Rosley
Published: (2009)

A Model For The Fuzzy Front End Of New Product Development Process
by: Abd Rahman, Md Nizam
Published: (2016)

Optimum Flash-Less Cold Forging Process For AUV Propeller Fabrication With FEM
by: Tandur, Kahleed Hussain M
Published: (2010)

Experimental And Numerical Investigation For Cooling Performance Of High Power Light Emitting Diode (Led) Arrays Using Heat Sink
by: Mohamad, Muhammad Sofwan
Published: (2012)

Finite Volume Based Numerical Investigation On The Effects Of Internal Cooling And Film Cooling On The Thermal Performance Of Gas Turbine Blades
by: Shaker, Sufian Farid
Published: (2010)

Diagnosis Using Bayesian Networks To Enable Value-Added Troubleshooting To Manufacturing Process Problem.
by: Mohd Fadzil, Lokman
Published: (2007)

Optimizing Of Injection Moulding Process Parameters For Recycled Plastic Material Using Taguchi Method
by: Mehat, Nik Mizamzul
Published: (2010)

In Process Roughness Measurement And Tool Nose Radius Wear Assesment In Finish Turning Using Machine Vision
by: Balasundaram, Mohan Kumar
Published: (2017)

An Integration Of Taguchi Method And Grey Relational Analysis In Optimizing Injection Moulding Processing Parameter Of Recycled Plastic
by: Zakarria, Noor Syuhadah
Published: (2014)

Study Of Processing Parameters In Manufacturing Of Flat Glass-Epoxy Composite Laminates Using Vacuum Bagging Oven Curing
by: Hanafiah, Nur Hafzareen Md
Published: (2013)

Modified Statistical Process Control For Short Runs Test And Measurement Process To Reduce False Alarm
by: Koh, Chin Kok
Published: (2018)

Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Investigation Of Non-Uniform Thickness Section Effect On Twist Springback Behaviour
by: Nashrudin, Muhammad Nazmi
Published: (2018)

Non-Newtonian Fluid Analytical Filling Time Model With Contact Line Jump Underfill Encapsulation
by: Ng, Fei Chong
Published: (2019)

Vibration Analysis Of The Chenderoh Dam Structure Due To The Effects Of Water Spilling And Surging
by: Ghazali, Mohamad Hazwan Mohd
Published: (2019)

Development Of Generative Computer-Aided Process Planning For Cnc Milling Parts_Pramodkumar S Kataraki
by: S Kataraki, Pramodkumar
Published: (2019)

Numerical analysis of multistenosed multiphase patient’s specific left coronary artery subjected to fluid structure interaction / Abdulgaphur Athani
by: Abdulgaphur , Athani
Published: (2022)

Automated Core And Cavity Design System For Mould Works Using Generative Method Of Computer Aided Process Planning
by: Md Yusof, Mursyidah
Published: (2017)

Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)

Hybrid non-destructive assessment for flow induced vibration piping systems using coupled fluid-structure interaction / Kong Keen Kuan
by: Kong , Keen Kuan
Published: (2020)