Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process

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At present, researchers begin to reinforce nanoparticles into Pb free solders to develop high efficiency nanocomposite solders. The effects on nanoparticle reinforcement into SAC 305 after reflow to enhance the solder joint quality are focus of this research. Consequently, this investigation develop...

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Bibliographic Details
Main Author:	Chellvarajoo, Srivalli
Format:	Thesis
Language:	English
Published:	2016
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41168/
Abstract	Abstract here

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