Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
At present, researchers begin to reinforce nanoparticles into Pb free solders to develop high efficiency nanocomposite solders. The effects on nanoparticle reinforcement into SAC 305 after reflow to enhance the solder joint quality are focus of this research. Consequently, this investigation develop...
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| Format: | Thesis |
| Language: | English |
| Published: |
2016
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| Subjects: | |
| Online Access: | http://eprints.usm.my/41168/ |
| Abstract | Abstract here |
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Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
Published 2016
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Thesis
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Universiti Sains Malaysia