20-Gbps High-Speed Converged I/O Loop Back Test Design Methodology For Signal Integrity Enhancement

In high-volume manufacturing (HVM), the degradations of signals at high speed and high frequencies will affect test results. In the semiconductor field, inaccuracies of test setup impact a product yield, increase test operating cost and delay products release time. With the demand for rapid improve...

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Bibliographic Details
Main Author:	Shanmugam, Ragubalan
Format:	Thesis
Language:	English
Published:	2015
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.usm.my/41327/
Abstract	Abstract here

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