Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2011
|
| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.usm.my/41879/ |
| _version_ | 1846216300868665344 |
|---|---|
| author | Ang , Karen Huei Ling |
| author_facet | Ang , Karen Huei Ling |
| author_sort | Ang , Karen Huei Ling |
| description | Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film. |
| first_indexed | 2025-10-17T08:17:48Z |
| format | Thesis |
| id | usm-41879 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2025-10-17T08:17:48Z |
| publishDate | 2011 |
| record_format | eprints |
| spelling | usm-418792019-04-12T05:26:33Z http://eprints.usm.my/41879/ Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process Ang , Karen Huei Ling TN1-997 Mining engineering. Metallurgy Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay could change the profile of the structures and residues of precursor might leave on the film. In Infineon technologies, those wafers are scrapped if time delay exceeded 5 hours and every scrapped cost RM37500. As such, a study is carried out to investigate the effect of time delay in photolithography process to the cured polyimide film. 2011-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf Ang , Karen Huei Ling (2011) Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Ang , Karen Huei Ling Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title | Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title_full | Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title_fullStr | Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title_full_unstemmed | Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title_short | Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process |
| title_sort | investigation of process time delay on polyimide with different thicknesses for photolithography process |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/41879/ |
| work_keys_str_mv | AT angkarenhueiling investigationofprocesstimedelayonpolyimidewithdifferentthicknessesforphotolithographyprocess |