Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Ang , Karen Huei Ling
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2011
الموضوعات:	TN1-997 Mining engineering. Metallurgy
الوصول للمادة أونلاين:	http://eprints.usm.my/41879/

مواد مشابهة

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