Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

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Détails bibliographiques
Auteur principal:	Ang , Karen Huei Ling
Format:	Thèse
Langue:	anglais
Publié:	2011
Sujets:	TN1-997 Mining engineering. Metallurgy
Accès en ligne:	http://eprints.usm.my/41879/

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