Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process
Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...
| 第一著者: | Ang , Karen Huei Ling |
|---|---|
| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2011
|
| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41879/ |
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