Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2012
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/41921/ |
| Abstract | Abstract here |