Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit...

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Bibliographic Details
Main Author:	Hashim, Md. Amin
Format:	Thesis
Language:	English
Published:	2011
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/42008/
Abstract	Abstract here

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