Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views
Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2010
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/42392/ |
| 要約: | Machine vision has been widely deployed in many industrial applications.
However, the use of machine vision to perform solder joint inspection of electronic
assembly has yet to reach the desired maturity level. Solder joint surfaces are minute,
curved and the shapes tend to vary greatly with the soldering conditions. These
characteristics have posted a challenging task to develop an effective machine vision
with acceptable level of classification accuracy. This research aims to investigate a
new methodology of inspecting solder joint through analysis of the combined image
from two viewing directions; one from orthogonal view while the other from oblique
view. The concept based on the physics of surface tension, contact angle and slant
angle of solder joint fillet. |
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