Application Of Machine Vision On Solder Joint Inspection Using Orthogonal And Oblique Views

Machine vision has been widely deployed in many industrial applications. However, the use of machine vision to perform solder joint inspection of electronic assembly has yet to reach the desired maturity level. Solder joint surfaces are minute, curved and the shapes tend to vary greatly with the...

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書目詳細資料
主要作者: Ong , Teng Yeow
格式: Thesis
語言:英语
出版: 2010
主題:
在線閱讀:http://eprints.usm.my/42392/