Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
Lead-based solders have been used extensively for chip-attach and surface-mount processes in the electronic industry, and in marine applications. However, because of toxicity issues related to lead, efforts to develop a cost-effective lead-free replacement have been ongoing. This work investi...
| मुख्य लेखक: | Ridhai, Mohammed Noori |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2010
|
| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.usm.my/43019/ |
समान संसाधन
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
द्वारा: Duong, Ngoc Binh
प्रकाशित: (2005)
द्वारा: Duong, Ngoc Binh
प्रकाशित: (2005)
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
द्वारा: Osman, Saliza Azlina
प्रकाशित: (2008)
द्वारा: Osman, Saliza Azlina
प्रकाशित: (2008)
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
द्वारा: Hashim, Md. Amin
प्रकाशित: (2011)
द्वारा: Hashim, Md. Amin
प्रकाशित: (2011)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
द्वारा: Tai, Siew Fong
प्रकाशित: (2003)
द्वारा: Tai, Siew Fong
प्रकाशित: (2003)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
द्वारा: Baser, Muhammad Fadlin Hazim
प्रकाशित: (2020)
द्वारा: Baser, Muhammad Fadlin Hazim
प्रकाशित: (2020)
Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
द्वारा: Lee , Liu Mei
प्रकाशित: (2013)
द्वारा: Lee , Liu Mei
प्रकाशित: (2013)
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
द्वारा: Lee, Liu Mei
प्रकाशित: (2013)
द्वारा: Lee, Liu Mei
प्रकाशित: (2013)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
द्वारा: Chellvarajoo, Srivalli
प्रकाशित: (2016)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
द्वारा: Mohammad Hossein, Mahdavifard
प्रकाशित: (2017)
द्वारा: Mohammad Hossein, Mahdavifard
प्रकाशित: (2017)
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
द्वारा: Nadhrah, Murad
प्रकाशित: (2021)
द्वारा: Nadhrah, Murad
प्रकाशित: (2021)
Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
द्वारा: Abu Bakar, Nur Adriana Nazifa
प्रकाशित: (2019)
द्वारा: Abu Bakar, Nur Adriana Nazifa
प्रकाशित: (2019)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
द्वारा: Zhou , Ding
प्रकाशित: (2024)
द्वारा: Zhou , Ding
प्रकाशित: (2024)
Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys / Nurul Liyana Kamaruzaman
द्वारा: Nurul Liyana, Kamaruzaman
प्रकाशित: (2018)
द्वारा: Nurul Liyana, Kamaruzaman
प्रकाशित: (2018)
Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
द्वारा: Abdullah, Nabihah
प्रकाशित: (2019)
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
द्वारा: Zakaria, Mohamad Fadley
प्रकाशित: (2008)
द्वारा: Zakaria, Mohamad Fadley
प्रकाशित: (2008)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
द्वारा: Mayappan, Ramani
प्रकाशित: (2007)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
द्वारा: Yahya, Iziana
प्रकाशित: (2016)
द्वारा: Yahya, Iziana
प्रकाशित: (2016)
Characterization of Sn-Bi-Co low temperature solder alloy / Lina Syazwana Kamaruzzaman
द्वारा: Lina Syazwana , Kamaruzzaman
प्रकाशित: (2023)
द्वारा: Lina Syazwana , Kamaruzzaman
प्रकाशित: (2023)
Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
द्वारा: Leong , Yee Mei
प्रकाशित: (2020)
द्वारा: Leong , Yee Mei
प्रकाशित: (2020)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
द्वारा: Maliessa Nabilah, Mazelan
प्रकाशित: (2023)
द्वारा: Maliessa Nabilah, Mazelan
प्रकाशित: (2023)
Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
द्वारा: Krishna, Vidyatharran
प्रकाशित: (2020)
द्वारा: Krishna, Vidyatharran
प्रकाशित: (2020)
Synthesis Of TiO2 Nanoparticles And Characterization Of Sn-3.0Ag-0.5Cu/TiO2 Via Nanoindentation And Selective Electrochemical Etching
द्वारा: Yahaya@Kamaluddin, Muhamad Zamri
प्रकाशित: (2018)
द्वारा: Yahaya@Kamaluddin, Muhamad Zamri
प्रकाशित: (2018)
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
द्वारा: Ab Ghani, Noor Asikin
प्रकाशित: (2016)
द्वारा: Ab Ghani, Noor Asikin
प्रकाशित: (2016)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
द्वारा: Abu Hassan, Nurfazlin
प्रकाशित: (2009)
द्वारा: Abu Hassan, Nurfazlin
प्रकाशित: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
द्वारा: Idris, Siti Rabiatull Aisha
प्रकाशित: (2008)
द्वारा: Idris, Siti Rabiatull Aisha
प्रकाशित: (2008)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
द्वारा: Nabila, Tamar Jaya
प्रकाशित: (2024)
द्वारा: Nabila, Tamar Jaya
प्रकाशित: (2024)
Fabrication of BaTiO3, BaSnO3 and Sn-doped BaTiO3 compact layers for enhanced dye sensitized solar cell
द्वारा: R.M. Fiter, Logeswary
प्रकाशित: (2024)
द्वारा: R.M. Fiter, Logeswary
प्रकाशित: (2024)
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
द्वारा: Syed Hassan , Abbas Jaffery
प्रकाशित: (2017)
द्वारा: Syed Hassan , Abbas Jaffery
प्रकाशित: (2017)
Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
द्वारा: Goh, Ying Xin
प्रकाशित: (2015)
द्वारा: Goh, Ying Xin
प्रकाशित: (2015)
Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
द्वारा: Dele-Afolabi, Temitope Theophilus
प्रकाशित: (2015)
द्वारा: Dele-Afolabi, Temitope Theophilus
प्रकाशित: (2015)
Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
द्वारा: Ghani, Fitriah Abdul
प्रकाशित: (2018)
द्वारा: Ghani, Fitriah Abdul
प्रकाशित: (2018)
Effect of 1,2-dipalmitoyl-sn-glycero-3-phosphoethanolamine (dppe)-peg2000 and 1,2-dipalmitoyl-sn-glycero-3-phosphoethanolamine (dppe)-peg5000 on fatty acid nanoliposomes and their langmuir monolayer / Teo Yin Yin
द्वारा: Teo, Yin Yin
प्रकाशित: (2012)
द्वारा: Teo, Yin Yin
प्रकाशित: (2012)
Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
द्वारा: Zetty Akhtar, Abd Malek
प्रकाशित: (2017)
द्वारा: Zetty Akhtar, Abd Malek
प्रकाशित: (2017)
Electroplating Of Cu-Sn Alloys And Compositionally Modulated Multilayers Of Cu-Sn-Zn-Ni Alloys On Mild Steel Substrate [TS693. H282 2007 f rb].
द्वारा: Hariyanti, Hariyanti
प्रकाशित: (2007)
द्वारा: Hariyanti, Hariyanti
प्रकाशित: (2007)
Effect of heat treatment on the microstructures and corrosion behaviour of quaternary mg-2.2zn-3.7re-0.5ca alloys for biomedical applications
द्वारा: Hasbullah, Nurul Ai'zzah
प्रकाशित: (2015)
द्वारा: Hasbullah, Nurul Ai'zzah
प्रकाशित: (2015)
Effect of aging and heat treatment on the optical properties of ZnS, SnS and Se thin films
द्वारा: Abdelrahman, Abubaker Elshiekh
प्रकाशित: (2000)
द्वारा: Abdelrahman, Abubaker Elshiekh
प्रकाशित: (2000)
Programming SnO2 gas Sensor using Arduino microcontroller
द्वारा: Almaroof, Hasan Mudar
प्रकाशित: (2018)
द्वारा: Almaroof, Hasan Mudar
प्रकाशित: (2018)
समान संसाधन
-
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
द्वारा: Duong, Ngoc Binh
प्रकाशित: (2005) -
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
द्वारा: Osman, Saliza Azlina
प्रकाशित: (2008) -
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
द्वारा: Hashim, Md. Amin
प्रकाशित: (2011) -
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
द्वारा: Tai, Siew Fong
प्रकाशित: (2003) -
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
द्वारा: Baser, Muhammad Fadlin Hazim
प्रकाशित: (2020)