Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
Lead-based solders have been used extensively for chip-attach and surface-mount processes in the electronic industry, and in marine applications. However, because of toxicity issues related to lead, efforts to develop a cost-effective lead-free replacement have been ongoing. This work investi...
| Main Author: | Ridhai, Mohammed Noori |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/43019/ |
| Abstract | Abstract here |
Similar Items
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011)
by: Hashim, Md. Amin
Published: (2011)
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013)
by: Lee, Liu Mei
Published: (2013)
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
by: Duong, Ngoc Binh
Published: (2005)
by: Duong, Ngoc Binh
Published: (2005)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
Intermetallic and leaching study of (sn-8zn-3bi)-1ag lead-free solder / Nor Aishah Jasli
by: Jasli, Nor Aishah
Published: (2016)
by: Jasli, Nor Aishah
Published: (2016)
Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)
by: Lee , Liu Mei
Published: (2013)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)
by: Mohammad Hossein, Mahdavifard
Published: (2017)
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
by: Nadhrah, Murad
Published: (2021)
by: Nadhrah, Murad
Published: (2021)
Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
by: Abu Bakar, Nur Adriana Nazifa
Published: (2019)
by: Abu Bakar, Nur Adriana Nazifa
Published: (2019)
Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
by: Zhou , Ding
Published: (2024)
by: Zhou , Ding
Published: (2024)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
by: Abdullah, Nabihah
Published: (2019)
by: Abdullah, Nabihah
Published: (2019)
Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
by: Abdullah, Nabihah
Published: (2019)
by: Abdullah, Nabihah
Published: (2019)
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
by: Zakaria, Mohamad Fadley
Published: (2008)
by: Zakaria, Mohamad Fadley
Published: (2008)
Activation energy study of intermetallic with the addition of graphene nanosheets into Sn-3.5Ag lead-free solder / Amirah Salleh
by: Salleh, Amirah
Published: (2021)
by: Salleh, Amirah
Published: (2021)
Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys / Nurul Liyana Kamaruzaman
by: Nurul Liyana, Kamaruzaman
Published: (2018)
by: Nurul Liyana, Kamaruzaman
Published: (2018)
Characterization of Sn-Bi-Co low temperature solder alloy / Lina Syazwana Kamaruzzaman
by: Lina Syazwana , Kamaruzzaman
Published: (2023)
by: Lina Syazwana , Kamaruzzaman
Published: (2023)
A study of Sn-Ag-Cu solder interconnection behaviour under gamma radiation exposure
by: Rosman, Muhammad Nur Hisyam
Published: (2025)
by: Rosman, Muhammad Nur Hisyam
Published: (2025)
Radiation doses effect on micromechanical properties, microstructure evolution and thermal stability of Sn-Ag-Cu solder
by: Nur Farisa Nadia, Mohmad Lehan
Published: (2025)
by: Nur Farisa Nadia, Mohmad Lehan
Published: (2025)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)
by: Maliessa Nabilah, Mazelan
Published: (2023)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
by: Krishna, Vidyatharran
Published: (2020)
by: Krishna, Vidyatharran
Published: (2020)
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
by: Ab Ghani, Noor Asikin
Published: (2016)
by: Ab Ghani, Noor Asikin
Published: (2016)
Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
by: Leong , Yee Mei
Published: (2020)
by: Leong , Yee Mei
Published: (2020)
Synthesis Of TiO2 Nanoparticles And Characterization Of Sn-3.0Ag-0.5Cu/TiO2 Via Nanoindentation And Selective Electrochemical Etching
by: Yahaya@Kamaluddin, Muhamad Zamri
Published: (2018)
by: Yahaya@Kamaluddin, Muhamad Zamri
Published: (2018)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)
by: Nabila, Tamar Jaya
Published: (2024)
Fabrication of BaTiO3, BaSnO3 and Sn-doped BaTiO3 compact layers for enhanced dye sensitized solar cell
by: R.M. Fiter, Logeswary
Published: (2024)
by: R.M. Fiter, Logeswary
Published: (2024)
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
by: Syed Hassan , Abbas Jaffery
Published: (2017)
by: Syed Hassan , Abbas Jaffery
Published: (2017)
Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
by: Goh, Ying Xin
Published: (2015)
by: Goh, Ying Xin
Published: (2015)
Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
by: Dele-Afolabi, Temitope Theophilus
Published: (2015)
by: Dele-Afolabi, Temitope Theophilus
Published: (2015)
Effect of 1,2-dipalmitoyl-sn-glycero-3-phosphoethanolamine (dppe)-peg2000 and 1,2-dipalmitoyl-sn-glycero-3-phosphoethanolamine (dppe)-peg5000 on fatty acid nanoliposomes and their langmuir monolayer / Teo Yin Yin
by: Teo, Yin Yin
Published: (2012)
by: Teo, Yin Yin
Published: (2012)
Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
by: Zetty Akhtar, Abd Malek
Published: (2017)
by: Zetty Akhtar, Abd Malek
Published: (2017)
Development and application of ultrasonic soldering for lap joint between glass and pewter (Sn5Sb1.2Cu)
by: Mohd Yusry Mustafa
Published: (2024)
by: Mohd Yusry Mustafa
Published: (2024)
Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
by: Ghani, Fitriah Abdul
Published: (2018)
by: Ghani, Fitriah Abdul
Published: (2018)
Electroplating Of Cu-Sn Alloys And Compositionally Modulated Multilayers Of Cu-Sn-Zn-Ni Alloys On Mild Steel Substrate [TS693. H282 2007 f rb].
by: Hariyanti, Hariyanti
Published: (2007)
by: Hariyanti, Hariyanti
Published: (2007)
Programming SnO2 gas Sensor using Arduino microcontroller
by: Almaroof, Hasan Mudar
Published: (2018)
by: Almaroof, Hasan Mudar
Published: (2018)
GeSn Film Deposited By Rf Magnetron Sputtering For Photodetector Applications
by: Sheikh Sarmast, Hadi Mahmodi
Published: (2017)
by: Sheikh Sarmast, Hadi Mahmodi
Published: (2017)
Similar Items
-
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011) -
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013) -
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
by: Duong, Ngoc Binh
Published: (2005) -
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020) -
Intermetallic and leaching study of (sn-8zn-3bi)-1ag lead-free solder / Nor Aishah Jasli
by: Jasli, Nor Aishah
Published: (2016)
