Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency,...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2018
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/44223/ |
| Abstract | Abstract here |