Fabrication And Properties Of Silica-Epoxy Thin Film Composite

عرض إصدارات أخرى (1)

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Foo, Yin Lin Evon
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2012
الموضوعات:	TN1-997 Mining engineering. Metallurgy
الوصول للمادة أونلاين:	http://eprints.usm.my/44803/

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