Fabrication And Properties Of Silica-Epoxy Thin Film Composite

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With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

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Bibliographic Details
Main Author:	Foo, Yin Lin Evon
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/44803/

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