Fabrication And Properties Of Silica-Epoxy Thin Film Composite

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखक: Foo, Yin Lin Evon
स्वरूप: थीसिस
भाषा:अंग्रेज़ी
प्रकाशित: 2012
विषय:
ऑनलाइन पहुंच:http://eprints.usm.my/44803/

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