Fabrication And Properties Of Silica-Epoxy Thin Film Composite

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With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

書誌詳細
第一著者:	Foo, Yin Lin Evon
フォーマット:	学位論文
言語:	英語
出版事項:	2012
主題:	TN1-997 Mining engineering. Metallurgy
オンライン･アクセス:	http://eprints.usm.my/44803/

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