Fabrication And Properties Of Silica-Epoxy Thin Film Composite
With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2012
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| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.usm.my/44803/ |
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Fabrication And Properties Of Silicaepoxy Thin Film Composite
प्रकाशित 2012
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थीसिस
Universiti Sains Malaysia