Fabrication And Properties Of Silica-Epoxy Thin Film Composite

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

Description complète

Détails bibliographiques
Auteur principal: Foo, Yin Lin Evon
Format: Thèse
Langue:anglais
Publié: 2012
Sujets:
Accès en ligne:http://eprints.usm.my/44803/
Search Result 1