Time Domain Reflection Method To Detect Copper Wire Micro Crack Weld Defect

Structural integrity of wire bonding interconnection is having a significant impact on the quality of microelectronic devices. Conventional electrical test methodology is unable to detect 1 to 20 m of cracks that exists in wire bond stitch weld. This micro crack has becomes prominent in Power MO...

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Bibliographic Details
Main Author:	Robin, Ong Su Kiat
Format:	Thesis
Language:	English
Published:	2016
Subjects:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/45796/
Abstract	Abstract here

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