Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospace applications, continue to be in demand. Ag-Cu nanopaste, which is a mixture of Ag and Cu nanoparticles and organic additives (PVA binder, Ethylene glycol), has been introduced as die attachment...
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| Format: | Thèse |
| Langue: | anglais |
| Publié: |
2017
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| Accès en ligne: | http://eprints.usm.my/45824/ |
| Abstract | Abstract here |