Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications

Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospace applications, continue to be in demand. Ag-Cu nanopaste, which is a mixture of Ag and Cu nanoparticles and organic additives (PVA binder, Ethylene glycol), has been introduced as die attachment...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Noordin, Norasiah Mohammad
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2017
الموضوعات:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
الوصول للمادة أونلاين:	http://eprints.usm.my/45824/
Abstract	Abstract here

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