Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package

Nowadays, the technology of Integrated Circuit (IC) packaging has become a sophisticated design in addition to maintaining reliability and quality. Flip Chip Scale Package (CSP) is one of the IC chips which has a wafer-level packaged with spherical solder bump located on a grid with a pre-defined pi...

詳細記述

書誌詳細
第一著者: Azmi, Muhammad Afiq
フォーマット: 学位論文
言語:英語
出版事項: 2018
主題:
オンライン・アクセス:http://eprints.usm.my/46686/
Abstract Abstract here

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