Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package

Nowadays, the technology of Integrated Circuit (IC) packaging has become a sophisticated design in addition to maintaining reliability and quality. Flip Chip Scale Package (CSP) is one of the IC chips which has a wafer-level packaged with spherical solder bump located on a grid with a pre-defined pi...

Description complète

Détails bibliographiques
Auteur principal: Azmi, Muhammad Afiq
Format: Thèse
Langue:anglais
Publié: 2018
Sujets:
Accès en ligne:http://eprints.usm.my/46686/
Abstract Abstract here

Documents similaires