Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package

Nowadays, the technology of Integrated Circuit (IC) packaging has become a sophisticated design in addition to maintaining reliability and quality. Flip Chip Scale Package (CSP) is one of the IC chips which has a wafer-level packaged with spherical solder bump located on a grid with a pre-defined pi...

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Bibliographic Details
Main Author:	Azmi, Muhammad Afiq
Format:	Thesis
Language:	English
Published:	2018
Subjects:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/46686/
Abstract	Abstract here

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