Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application

Rapid development in wireless commination devices was lead to seriousness in electromagnetic pollution. The main aim of this study is develop an effective electromagnetic interferences (EMI) shielding composites for electronic packaging application. In the present study, an EMI shielding epoxy compo...

詳細記述

書誌詳細
第一著者: Phan, Chee Hong
フォーマット: 学位論文
言語:英語
出版事項: 2015
主題:
オンライン・アクセス:http://eprints.usm.my/46762/